The SensWear Complete Developer Bundle provides the full modular wearable development platform in one package, combining the core mainboard with all four sensing and interaction daughter boards at a reduced bundled price. Designed for researchers, developers, and innovators, this kit enables rapid prototyping of advanced wearable systems with synchronized multimodal sensing, interaction, and feedback.

At the center of the bundle is the SensWear Core Mainboard, powered by the nRF54L15, delivering wireless connectivity, embedded processing, motion sensing via the onboard BHI360 smart IMU, integrated LED control, and complete battery and power management. It acts as the central hub of the system, supplying regulated power and I²C connectivity to all attached modules.

The bundle includes four plug-and-play daughter boards:

• MAX30101 PPG Module – Multi-wavelength optical sensing (IR, Red, Green) for heart-rate, SpO₂, respiration, wear detection, and advanced cardiovascular research including blood pressure estimation and arterial stiffness analysis.
• MTCH6102 Touch Module – 15-channel linear capacitive touch interface enabling tap, swipe, and slide gestures, wear detection, and novel human–wearable interaction methods.
• MAX30208 Temperature Module – High-accuracy skin and body temperature sensing for health monitoring, circadian rhythm tracking, recovery analysis, and thermal-based physiological research.
• DRV2605 Haptic Module – Programmable vibration and LRA-based tactile feedback for notifications, biofeedback, and interactive wearable experiences.

Together, these modules create a fully integrated wearable R&D platform for multimodal physiological sensing, AI-driven health research, human–machine interaction, and rapid prototyping of next-generation wearable devices. The bundle offers a complete entry point into the SensWear ecosystem, providing maximum flexibility, scalability, and value for advanced wearable development.